Are You Planning To Stack Die?

IC Thermal Analysis for Your Chip

Computes full-chip, three-dimensional temperature profile at device- and interconnect-level resolution.

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Gradient chip

Reduce Risk in 60 Minutes

Gradient offers a free risk assessment call to help identify whether your chip may be at risk for thermal hazards.

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60 Minutes

“Gradient is helping AMD achieve closure on interconnect electromigration verification and device reliability taking into account actual hot spot temperature and reduce unnecessary conservatism in designs. We’re able to achieve thermal modeling resolution down to a single via which significantly enhances our electromigration avoidance capability.”

— Yuri Apanovich, Electrical Analysis Manager, Advanced Micro Devices

AMD